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AMMP-6220
6-20 GHz Low Noise Amplifier
Data Sheet
Description
Avago's AMMP-6220 is a high gain, low-noise amplifier that operates from 6 GHz to 20 GHz. The LNA is designed to be a easy-to-use component for any surface mount PCB application. The broad and unconditionally stable performance makes this LNA ideal for primary, sub-sequential or driver low noise gain stages. Intended applications include microwave radios, 802.16, automotive radar, VSAT, and satellite receivers. Since one part can cover several bands, the AMMP-6220 can reduce part inventory and increase volume purchase options. The LNA has integrated 50 W I/O match, DC blocking, self-bias and choke to eliminate complex tuning and assembly processes typically required by hybrid (discreteFET) amplifiers. The package is full SMT compatible with backside grounding and I/O to simplify assembly.
Features
* 5x5 mm surface mount package * Broad Band performance 6-20 GHz * Low 2.5 dB typical noise figure * High 22 dB typical gain * 50 W input and output match * Single 3 V (55 mA) supply bias
Applications
* Microwave radio systems * Satellite VSAT, DBS up/down link * LMDS & Pt-Pt mmW Long Haul * Broadband Wireless Access (including 802.16 and 802.20 WiMax)
Functional Diagram
PIN 1 2 3 4 5 6 7 8 FUNCTION Vd RFout
* WLL and MMDS loops * Commercial grade military
3
1
2
8
100 pF 100 pF
4
RFin
7
6
5
PACKAGE BASE GND
Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class 1A) ESD Human Body Model (Class 0) Refer to Avago Application Note A004R: Electrostatic Discharge Damage and Control.
AMMP-6220 Absolute Maximum Ratings [1] Symbol Parameters/Conditions Vd Positive Drain Voltage Id Drain Current Pin CW Input Power Tch Operating Channel Temp. Tstg Storage Case Temp. Tmax Maximum Assembly Temp. (60 sec max.)
Units V mA dBm C C C
Min.
-65
Max. 7 100 15 +150 +150 +300
Note: 1. Operation in excess of any one of these conditions may result in permanent damage to this device.
AMMP-6220 DC Specifications/Physical Properties [1] Symbol Parameters and Test Conditions Units Id Drain Supply Current (under any mA RF power drive and temperature) (Vd = 3.0 V) qch-b Thermal Resistance[2] (Backside temperature, Tb = 25C) C/W
Min.
Typ. 55
Max. 70
27
Notes: 1. Ambient operational temperature TA = 25C unless otherwise noted. 2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34C) as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb) = 25C calculated from measured data.
AMMP-6220 RF Specifications [3, 4, 6] TA= 25C, Vd = 3.0 V, Id(Q) = 55 mA, Zo = 50 W Symbol Parameters and Test Conditions Gain Small-signal Gain[5] NF Noise Figure into 50 W[5] P-1dB Output Power at 1dB Gain Compression OIP3 Third Order Intercept Point; f = 100 MHz; Pin = -20 dBm RLin Input Return Loss RLout Output Return Loss Isol Reverse Isolation
Units dB dB dBm dBm dB dB dB
Typical 22 2.5 +10 +20 -12 -16 -45
Sigma 0.5 0.2 0.8 1.1 0.3 0.7 0.5
Notes: 3. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25C. 4. Pre-assembly into package performance verified 100% on-wafer per AMMC-6220 published specifications. 5. This final package part performance is verified by a functional test correlated to actual performance at one or more frequencies. 6. Specifications are derived from measurements in a 50 W test environment. Aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
2
AMMP-6220 Typical Performances (TA = 25C, Vd =3 V, ID = 55 mA, Zin = Zout = 50 W unless otherwise stated)
Note: These measurements are in 50 W test environment. Aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity or low noise (Gopt) matching.
25 20 15
0 -10
0
-5
-20
S21 (dB) S21 (dB)
-30 -40
S11 (dB)
-10
10 5 0
-15
-50 -60
-20
4
6
8
10
12
14
16
18
20
22
4
6
8
10
12
14
16
18
20
22
4
6
8
10
12
14
16
18
20
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 1. Gain.
Figure 2. Isolation.
Figure 3. Input return loss.
0 -5 -10
4.0 3.5
25 20
S22 (dB)
2.5
OP-1dB & OIP3 (dBm)
3.0
-15 -20 -25 -30
NF (dB)
15 10 P-1dB OIP3 6 8 10 12 14 16 18 20
2.0 1.5 1.0 0.5
5 0
4
6
8
10
12
14
16
18
20
22
0
6
8
10
12
14
16
18
20
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 4. Output return loss.
Figure 5. Noise figure.
Figure 6. Typical power, OP-1dB and OIP3.
30 25 20
0 -10 -20 +25C -40C +85C
0 +25C -5 -40C +85C
S21 (dB)
S12 (dB)
15 10 5 0 +25C -40C +85C
-30 -40
S11 (dB)
4 6 8 10 12 14 16 18 20 22
-10
-15 -50 -60 -20
4
6
8
10
12
14
16
18
20
22
4
6
8
10
12
14
16
18
20
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. Gain over temperature.
Figure 8. Isolation over temperature.
Figure 9. Input return loss over temperature.
3
AMMP-6220 Typical Performances (TA = 25C, Vd = 3 V, ID = 55 mA, Zin = Zout = 50 W unless otherwise stated)
Note: These measurements are in 50 W test environment. Aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity or low noise (Gopt) matching.
0 +25C -5 -10 -40C +85C
4.0 3.5 3.0 2.5 +25C -40C +85C
62 +25C 60 58
Idd (mA)
-40C +85C
S22 (dB)
-15 -20 -25 -30
NF (dB)
2.0 1.5 1.0 0.5
56 54 52 50 3.0
4
6
8
10
12
14
16
18
20
22
0
6
8
10
12
14
16
18
20
3.5
4.0 Vdd (V)
4.5
5.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 10. Output return loss over temperature.
Figure 11. NF over temperature.
Figure 12. Bias current over temperature.
25 20 15
0 -10 -20 3V 4V 5V
0 3V -5 4V 5V
S21 (dB)
S12 (dB)
S11 (dB)
4 6 8 10 12 14 16 18 20 22
-30 -40
-10
10 3V 5 0 4V 5V 4 6 8 10 12 14 16 18 20 22
-15 -50 -60 -20
4
6
8
10
12
14
16
18
20
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 13. Gain over Vdd.
Figure 14. Isolation over Vdd.
Figure 15. Input RL over Vdd.
0 3V -5 -10
S22 (dB)
3.0
25 20
OIP3 (dBm)
4V 5V
2.5 2.0
NF (dB)
15 10
-15 -20 -25 -30
1.5 1.0 0.5 0 3V 4V 5V 6 8 10 12 14 16 18 20
3V 4V 5V
5 0
4
6
8
10
12
14
16
18
20
22
6
8
10
12
14
16
18
20
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 16. Output return loss over temperature.
Figure 17. Noise figure over Vdd.
Figure 18. OIP3 over Vdd.
4
AMMP-6220 Typical Scattering Parameters[1] (TA = 25C, Vd = 3 V, Zo = 50 W)
Freq GHz
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 24.5 25.0
S11 DB
-1.46 -1.03 -0.40 -4.65 -1.67 -1.39 -2.80 -1.59 -4.66 -8.62 -11.96 -14.57 -15.90 -16.48 -16.49 -16.53 -16.56 -16.19 -15.63 -14.36 -13.22 -12.30 -11.45 -10.83 -10.47 -10.32 -10.53 -10.62 -10.79 -10.97 -11.25 -11.47 -12.36 -13.30 -13.86 -13.77 -12.94 -11.42 -9.73 -8.00 -6.54 -5.44 -5.12 -4.72 -4.17 -3.40 -2.65
Mag
0.845 0.888 0.955 0.585 0.825 0.851 0.724 0.832 0.585 0.370 0.252 0.187 0.160 0.150 0.150 0.149 0.149 0.155 0.165 0.191 0.218 0.242 0.268 0.287 0.299 0.305 0.297 0.294 0.289 0.283 0.274 0.267 0.241 0.217 0.203 0.205 0.225 0.268 0.326 0.398 0.471 0.534 0.554 0.581 0.618 0.675 0.737
Phase
65.6 -4.4 -83.9 -150.2 153.6 72.8 18.7 -65.0 -144.6 148.4 93.4 48.4 12.5 -21.7 -58.8 -100.8 -147.1 161.1 108.2 54.8 3.0 -50.7 -102.0 -154.6 153.2 101.7 52.2 8.9 -33.2 -67.4 -109.8 -152.2 168.0 132.5 99.5 67.3 32.0 -6.3 -49.1 -94.4 -140.6 173.4 128.5 86.1 44.3 0.9 -44.6
S21 dB
-28.9 -10.6 6.1 10.6 6.2 16.6 19.6 22.8 23.5 23.6 23.6 23.3 23.2 23.1 23.1 23.2 23.2 23.3 23.4 23.6 23.8 23.7 23.7 23.6 23.2 22.7 22.3 22.1 21.9 21.5 21.4 21.0 20.9 20.6 20.4 20.1 19.8 19.4 18.5 18.2 17.7 16.9 16.3 15.3 13.7 12.6 11.6
Mag
0.036 0.292 2.027 3.420 2.051 6.764 9.563 13.836 15.077 15.218 15.198 14.717 14.575 14.429 14.408 14.455 14.462 14.624 14.926 15.226 15.497 15.483 15.450 15.143 14.518 13.724 13.168 12.858 12.536 11.970 11.796 11.331 11.208 10.720 10.474 10.158 9.847 9.413 8.500 8.140 7.703 7.055 6.535 5.881 4.894 4.288 3.822
Phase
-62.0 -147.1 96.8 -71.3 -104.2 -178.3 93.3 9.3 -72.4 -145.1 150.4 90.5 33.6 -20.9 -74.7 -126.9 -178.2 131.2 80.4 29.4 -20.8 -72.0 -122.8 -173.1 135.7 87.2 38.7 -8.5 -56.2 -102.6 -151.3 162.1 115.8 69.0 21.3 -25.9 -74.5 -121.1 -169.0 142.8 93.3 45.0 -3.1 -54.0 -102.8 -147.1 168.3
S12 dB
-60 -51 -46 -56 -61 -49 -45 -44 -50 -55 -58 -54 -52 -51 -47 -47 -46 -45 -43 -44 -42 -41 -41 -40 -40 -39 -40 -40 -42 -40 -39 -38 -38 -38 -38 -39 -38 -39 -39 -40 -40 -41 -43 -45 -47 -49 -50
Mag
0.001 0.003 0.005 0.001 0.001 0.003 0.005 0.006 0.003 0.002 0.001 0.002 0.002 0.003 0.004 0.004 0.005 0.006 0.007 0.006 0.008 0.008 0.008 0.010 0.009 0.010 0.009 0.009 0.008 0.009 0.011 0.012 0.012 0.012 0.012 0.011 0.012 0.011 0.011 0.010 0.010 0.009 0.007 0.005 0.004 0.003 0.003
INPUT REFERENCE PLANE FOR S-PARAMETERS
Phase
70.9 12.1 -72. 136.7 143.5 -86.3 140.2 26.4 -66.8 -116.2 153.4 89.9 33.2 -16.5 -46.2 -85.8 -121.8 -155.9 159.4 130.7 88.0 49.2 14.5 -26.9 -66.8 -104.7 -146.3 174.6 138.1 116.4 77.9 38.0 -5.3 -40.0 -82.3 -118.5 -161.5 162.1 124.7 79.8 35.1 2.9 -41.2 -84.6 -136.3 -162.8 134.1
S22 dB
-4.8 -9.6 -8.8 -6.3 -6.1 -9.3 -10.8 -15.5 -16.9 -16.7 -17.5 -19.5 -22.7 -24.6 -23.7 -21.9 -21.0 -21.3 -22.6 -23.8 -23.4 -21.3 -19.7 -17.8 -16.0 -14.4 -13.5 -13.2 -13.6 -12.7 -12.1 -12.1 -13.1 -14.2 -15.4 -16.5 -16.8 -16.8 -16.5 -16.1 -16.5 -17.3 -21.9 -18.0 -11.5 -9.0 -7.7
Mag
0.570 0.330 0.361 0.483 0.491 0.342 0.286 0.166 0.141 0.146 0.132 0.106 0.073 0.059 0.065 0.080 0.089 0.086 0.074 0.064 0.067 0.086 0.102 0.127 0.157 0.189 0.211 0.218 0.208 0.231 0.247 0.246 0.220 0.194 0.170 0.148 0.144 0.143 0.148 0.156 0.149 0.136 0.080 0.126 0.265 0.355 0.409
Phase
85.5 38.7 18.1 -46.1 -118.9 174.4 125.8 79.4 64.2 31.4 -8.7 -51.8 -103.7 -172.2 119.7 70.3 31.0 -3.6 -29.9 -46.2 -59.0 -90.7 -130.4 179.7 128.3 79.9 34.8 -4.6 -38.0 -65.0 -101.8 -140.0 179.3 139.1 94.9 44.7 -5.1 -51.5 -92.9 -132.8 -167.4 159.4 138.2 178.1 141.6 100.9 61.8
Note: Data obtained from ICM fixture measurements fully de-embedded to package edge.
OUTPUT REFERENCE PLANE FOR S-PARAMETERS (VIEW FROM PACKAGE BOTTOM)
5
Biasing and Operation
The AMMC-6220 is normally biased with a single positive drain supply connected to both VD pin through bypass capacitors as shown in Figure 19. The recommended supply voltage is 3 V. It is important to have 0.1 F bypass capacitor, and the capacitor should be placed as close to the component as possible. The AMMC-6220 does not require a negative gate voltage to bias any of the three stages. No ground wires are needed because all ground connections are made with plated through-holes to the backside of the package. Refer the Absolute Maximum Ratings table for allowed DC and thermal conditions.
VD (TYP. 3 V)
0.1 F
VD
1
2
3
RFout
RFin 8 100 pF 100 pF 4 RFout
RFin
7
6
5 PACKAGE BASE GND
Figure 19. Typical application.
Figure 20. Simplified MMIC schematic.
Figure 21. Demonstration board (available upon request).
6
Outline Drawing
1 2 3
A
8
AMMP XXXX YWWDNN
7 6 A FRONT VIEW 5
4
B SIDE VIEW MAX. 0.213 (5.4) 0.088 (2.25)
SYMBOL A B
MIN. 0.198 (5.03) 0.0685 (1.74)
DIMENSIONS ARE IN INCHES (MM)
0.114 (2.90) 0.011 (0.28) 0.018 (0.46) 3 2 1 0.014 (0.365)
*
0.126 (3.2) 0.059 (1.5) 4 8
0.016 (0.40)
0.100 (2.54) 0.029 (0.75) 5 0.016 (0.40) 6 7
0.012 (0.30)
0.028 (0.70) 0.100 (2.54) 0.93 (2.36) BACK VIEW
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
NOTES: 1. * INDICATES PIN 1 2. DIMENSIONS ARE IN INCHES (MILLIMETERS) 3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
Figure 22. Outline Drawing.
7
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes. The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern is available upon request from Avago Sales & Application Engineering.
Stencil Design Guidelines
A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is shown in Figure 24. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127 mm (5 mils) thick stainless steel which is capable of producing the required fine stencil outline. The combined PCB and stencil layout is shown in Figure 25.
Figure 23. Suggested PCB Land Pattern and Stencil Layout
Figure 24. Stencil Outline Drawing (mm)
Figure 25. Combined PCB and Stencil Layouts
8
Manual Assembly 1. Follow ESD precautions while handling packages. 2. Handling should be along the edges with tweezers. 3. Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Conductive epoxy is not recommended. Hand soldering is not recommended. 4. Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance. 5. Follow solder paste and vendor's recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. 6. Packages have been qualified to withstand a peak temperature of 260C for 20 seconds. Verify that the profile will not expose device beyond these limits.
Solder Reflow Profile The most commonly used solder reflow method is accomplished in a belt furnace using convection heat transfer. The suggested reflow profile for automated reflow processes is shown in Figure 26. This profile is designed to ensure reliable finished joints. However, the profile indicated in Figure 26 will vary among different solder pastes from different manufacturers and is shown here for reference only.
300 250 TEMPERATURE ( C) 200 150 100 50 RAMP 1 0 0 50 PREHEAT 100 RAMP 2 150 TIME (SECONDS) REFLOW 200 COOLING 250 300 PEAK = 250 5 C MELTING POINT = 218 C
Figure 26. Suggested lead-free reflow profile for SnAgCu solder paste.
AMMP-6220 Part Number Ordering Information Part Number AMMP-6220-BLK AMMP-6220-TR1 AMMP-6220-TR2 Devices Per Container 10 100 500 Container Antistatic bag 7" Reel 7" Reel
Device Orientation (Top View)
4 mm
12 mm AMMP XXXX AMMP XXXX AMMP XXXX
Carrier Tape and Pocket Dimensions
4.00 0.10 SEE NOTE #2 2.00 0.05 B 1.55 0.05 R 0.50 TYP. 1.75 0.10 5.50 0.05 Bo A Ko SECTION B-B Ao A o: B o: K o: PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 Ao MIN. 5.20 NOM. 5.30 MAX. 5.40 Bo 5.20 5.30 5.40 Ko 2.10 2.20 2.30 A 12.00 0.10 Ao
Bo
B
8.00 0.10
1.50 (MIN.)
Ko
0.30 0.05 SECTION A-A NOTES: 1. Ao AND Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET. 2. 10 PITCHES CUMULATIVE TOLERANCE IS 0.2 mm. 3. DIMENSIONS ARE IN MILLIMETERS (mm).
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4517EN AV02-0515EN - June 14, 2007

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